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PKUSZ and Nexchip Unveil the PKUSZ-Nexchip Joint Laboratory for Advanced Memory and Intelligent Manufacturing

time:2026-09-22 09:45autor:click:

On September 18, 2026, Peking University Shenzhen Graduate School (PKU Shenzhen) and Nexchip Semiconductor Corporation (NEXCHIP) held a signing and unveiling ceremony in Shenzhen for their jointly established PKUSZ-Nexchip Joint Laboratory for Advanced Memory and Intelligent Manufacturing. Attendees included WANG Tianbing, Vice Dean of PKU Shenzhen; Shi Lili, Director of the Office of Research Affairs at PKU Shenzhen; YANG Yuchao, Dean of the School of Electronic and Computer Engineering (SECE); LI Qian, Vice Dean of SECE; ZHANG Guanzhang, Tenured Associate Professor at SECE; and FAN Wenwen, Head of External Affairs at SECE. Representatives from NEXCHIP included Dr. JENG Chi-Cherng, Co-General Manager; Dr. Chiayen Li, Head of AI; and Dr. Wei Pang Chen, Director of the R&D Integration Center. Together, they witnessed this milestone in university–industry collaboration.


   

signing and unveiling ceremony


Building New Momentum for University–Industry Collaboration


WANG Tianbing opened the ceremony by welcoming and thanking the NEXCHIP delegation. He noted that PKU Shenzhen has long pursued differentiated development, international engagement, close ties with industry, and the translation of research into practical applications. Research, he emphasized, should go beyond academic publications and patent applications to address real-world challenges and deliver tangible outcomes. He expressed the hope that the joint laboratory would accelerate technology development and product application while creating new opportunities for faculty development and talent cultivation.


                           


WANG Tianbing delivers opening remarks


SHI Lili reviewed the ten-month preparation process that led to the laboratory’s establishment. She noted that PKU Shenzhen has established 25 university–industry joint laboratories in recent years, 11 of them through SECE, reflecting the School’s leading role in industry–academia–research collaboration. The new laboratory will bring together SECE’s strengths in frontier technologies and NEXCHIP’s industrial capabilities. She expressed the hope that it would develop into an integrated innovation platform spanning talent development and cutting-edge research.


                           


SHI Lili speaks at the ceremony


On behalf of SECE, YANG Yuchao congratulated both parties on the launch of the laboratory. He stressed that information disciplines must work closely with industry to solve practical challenges of genuine importance to companies. SECE will provide full support and position the laboratory as a platform for deeper collaboration among faculty members, students, and researchers, advancing the integration of industry and education. His research team will also support process optimization to achieve stable, high-yield manufacturing for new product development.


                           


YANG Yuchao addresses the ceremony



Dr. JENG Chi-Cherng said that the laboratory’s research agenda is closely aligned with NEXCHIP’s future development. He looked forward to drawing on SECE’s strong academic foundation to complement the company’s industrial expertise, creating a model of mutually reinforcing collaboration. He also hoped the partnership would expand talent exchanges and enable both sides to explore new technology pathways.



                           

Dr. JENG Chi-Cherng speaks at the ceremony


ZHANG Guanzhang thanked the NEXCHIP leadership for its efforts in advancing the establishment of the laboratory. He said the team would follow the laboratory’s implementation plan closely and deliver each milestone as scheduled. He added that substantial preparatory work had already been completed before the signing, laying a solid foundation for the partnership.



                           


ZHANG Guanzhang speaks at the ceremony



By combining SECE’s research capabilities with NEXCHIP’s industrial experience, the joint laboratory will promote complementary strengths and collaborative innovation while supporting the needs of related industries.


Agreement Signed, Partnership Launched


The two parties then formally signed the cooperation agreement. ZHANG Guanzhang of SECE and Dr. Wei Pang Chen, Director of NEXCHIP’s R&D Integration Center, signed on behalf of their respective institutions, with Dr. JENG Chi-Cherng and YANG Yuchao serving as witnesses.


                           

Signing ceremony for the joint laboratory


Appointment letters were subsequently presented to the laboratory director, expert advisers, and other members. During the discussion that followed, the two parties agreed to promote reciprocal visits, review project progress regularly, deepen the partnership, explore emerging fields, and jointly develop new strategic initiatives.


                           

Presentation of appointment letters


About NEXCHIP

Nexchip Semiconductor Corporation (NEXCHIP) was established in May 2015 as a joint venture between Hefei Construction Investment Holding (Group) Co., Ltd. and Powerchip Investment Holding Corporation. Located in the Comprehensive Bonded Zone of Hefei Xinzhan High-tech Industrial Development Zone, it is Anhui Province’s first 12-inch wafer foundry.


NEXCHIP specializes in semiconductor wafer foundry services and is committed to strengthening China’s independent and controllable integrated-circuit manufacturing capabilities. The company provides process technologies from 150 nm to 28 nm and plans to introduce more advanced nodes. It listed on the STAR Market of the Shanghai Stock Exchange in May 2023, becoming Anhui Province’s first pure-play wafer foundry to enter the capital market. In July 2026, NEXCHIP listed on the Hong Kong Stock Exchange, marking a new chapter in its global development.


NEXCHIP has achieved mass production across multiple platforms, including display driver integrated circuits (DDIC), CMOS image sensors (CIS), microcontrollers (MCU), power-management integrated circuits (PMIC), and logic products. Its solutions serve a broad range of applications, including consumer electronics, smartphones, smart home appliances, security systems, industrial control, and automotive electronics.